王德祥|副教授

Update Delete

ID334
姓名王德祥|副教授
职位4
联系方式
个人简介<p><span style="font-size:16px;font-family:宋体">王德祥，男，工学博士，副教授，硕士研究生导师，青岛理工大学高层次优秀人才，主要从事磨粒加工理论与应用技术的研究工作。主持国家级、省部级等科研项目<span>6</span>项，参与国家级、省部级科研项目<span>6</span>项，发表论文二十余篇，其中以第一作者发表<span>SCI/EI</span>论文<span>11</span>篇。</span></p><p><span style="font-size:16px;font-family:宋体">研究领域</span></p><p><span style="font-size:16px;font-family:宋体">1.</span><span style="font-size:16px;font-family:宋体">磨粒加工理论与应用技术</span></p><p><span style="font-size:16px;font-family:宋体">2.</span><span style="font-size:16px;font-family:宋体">轴承滚道表面状态可控性制造</span></p><p><span style="font-size:16px;font-family:宋体">3.</span><span style="font-size:16px;font-family:宋体">微细磨削加工机理与应用</span></p><p><br/></p>
研究课题<p><strong><span style="font-size:16px;font-family:宋体">研究课题</span></strong></p><p><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">[1] </span><span style="font-size:16px;font-family:宋体">低温石墨烯</span><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">/</span><span style="font-size:16px;font-family: 宋体">离子液纳米流体微量润滑磨削界面换热及摩擦学机理研究，国家自然科学基金，</span><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">2018/01~2020/12</span><span style="font-size:16px;font-family:宋体">，</span><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">22</span><span style="font-size:16px;font-family:宋体">万元，主持。</span></p><p><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">[2] </span><span style="font-size:16px;font-family:宋体">纳米颗粒在微量润滑磨削界面的摩擦学行为研究，第</span><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">64</span><span style="font-size:16px;font-family:宋体">批中国博士后科学基金面上资助二等资助，</span><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">2018/11~2020/11</span><span style="font-size:16px;font-family:宋体">，</span><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">5</span><span style="font-size:16px;font-family:宋体">万元，主持。</span></p><p><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">[3] </span><span style="font-size:16px;font-family:宋体">球形纳米颗粒在纳米流体微量润滑磨削界面减摩抗磨的摩擦学机理研究，青岛市博士后应用研究项目资助，</span><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">2018/11~2020/11</span><span style="font-size:16px;font-family:宋体">，</span><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">5</span><span style="font-size:16px;font-family:宋体">万元，主持。</span></p><p><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">[4] </span><span style="font-size:16px;font-family:宋体">纳米流体改善微量润滑磨削界面油膜特性的摩擦学机理，青岛市应用基础研究计划项目，</span><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">2019/08~2021/08</span><span style="font-size:16px;font-family:宋体">，</span><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">10</span><span style="font-size:16px;font-family:宋体">万元，主持。</span></p><p><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">[5] </span><span style="font-size:16px;font-family:宋体">基于低温纳米流体微量润滑的轴承滚道表面完整性研究，企业委托课题，</span><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">2022/06~2025/05</span><span style="font-size:16px;font-family:宋体">，</span><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">20</span><span style="font-size:16px;font-family:宋体">万元，主持。</span></p><p><br/></p>
研究成果<p><strong><span style="font-size:16px;font-family:宋体">研究成果</span></strong></p><p style="margin-left:28px"><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">[1]&nbsp; Wang D, Zhang Y, Zhao Q, et al. Tribological&nbsp; mechanism of carbon group nanofluids on grinding interface under minimum quantity lubrication based on molecular dynamics simulation[J]. Frontiers of mechanical engineering, 2023, 18(1): 17.</span></p><p style="margin-left:28px"><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">[2]&nbsp; </span><span style="font-size:16px;font-family:宋体">王德祥</span><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">, </span><span style="font-size:16px;font-family:宋体">赵齐亮</span><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">, </span><span style="font-size:16px;font-family:宋体">张宇</span><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">, </span><span style="font-size:16px;font-family:宋体">等</span><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">. </span><span style="font-size:16px;font-family:宋体">离子液体在微量润滑磨削界面的摩擦学机理研究</span><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">[J]. </span><span style="font-size:16px;font-family:宋体">中国机械工程，</span><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">2022, 33(5): 560-568.</span></p><p style="margin-left:28px"><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">[3]&nbsp; </span><span style="font-size:16px;font-family:宋体">王德祥</span><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">, </span><span style="font-size:16px;font-family:宋体">孙树峰</span><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">, </span><span style="font-size:16px;font-family:宋体">唐沂珍</span><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">, </span><span style="font-size:16px;font-family:宋体">等</span><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">. </span><span style="font-size:16px;font-family:宋体">微量润滑磨削界面的分子动力学模拟</span><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">[J]. </span><span style="font-size:16px;font-family:宋体">西安交通大学学报</span><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">, 2020, 54(12): 168-175.</span></p><p style="margin-left:28px"><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">[4]&nbsp; Wang D, Sun S, Jiang J, et al. From the grain/workpiece interaction to the coupled thermal-mechanical residual stresses: an integrated modeling for controlled stress grinding of bearing ring raceway[J]. The International Journal of Advanced Manufacturing Technology, 2019, 101(1-4): 475-499.</span></p><p style="margin-left:28px"><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">[5]&nbsp; </span><span style="font-size:16px;font-family:宋体">王德祥</span><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">, </span><span style="font-size:16px;font-family:宋体">孙树峰</span><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">, </span><span style="font-size:16px;font-family:宋体">颜丙亮</span><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">,</span><span style="font-size:16px;font-family:宋体">等</span><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">. </span><span style="font-size:16px;font-family:宋体">已加工表面热源模型研究及磨削温度场数值模拟</span><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">[J]. </span><span style="font-size:16px;font-family:宋体">西安交通大学学报</span><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">, 2018, 52(4): 84-89.</span></p><p style="margin-left:28px"><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">[6]&nbsp; Wang D, Sun S, Jiang J, et al. The profile analysis and selection guide for the heat source on the finished surface in grinding[J]. Journal of Manufacturing Processes, 2017, 30:178-186.</span></p><p style="margin-left:28px"><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">[7]&nbsp; Wang D, Ge P, Sun S, et al. Investigation on the heat source profile on the finished surface in grinding based on the inverse heat transfer analysis[J]. International Journal of Advanced Manufacturing Technology, 2017, 92(2):1-16.</span></p><p style="margin-left:28px"><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">[8]&nbsp; </span><span style="font-size:16px;font-family:宋体">王德祥</span><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">, </span><span style="font-size:16px;font-family:宋体">葛培琪</span><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">, </span><span style="font-size:16px;font-family:宋体">毕文波</span><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">,</span><span style="font-size:16px;font-family:宋体">等</span><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">. </span><span style="font-size:16px;font-family:宋体">磨削弧区热源分布形状研究</span><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">[J]. </span><span style="font-size:16px;font-family:宋体">西安交通大学学报</span><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">, 2015, 49(8):116-121.</span></p><p style="margin-left:28px"><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">[9]&nbsp; </span><span style="font-size:16px;font-family:宋体">王德祥</span><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">, </span><span style="font-size:16px;font-family:宋体">葛培琪</span><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">, </span><span style="font-size:16px;font-family:宋体">毕文波</span><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">,</span><span style="font-size:16px;font-family:宋体">等</span><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">. </span><span style="font-size:16px;font-family:宋体">滚动轴承内圈滚道表层残余应力分布实验研究</span><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">[J]. </span><span style="font-size:16px;font-family:宋体">华中科技大学学报</span><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">(</span><span style="font-size:16px;font-family:宋体">自然科学版</span><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">), 2015(3):12-16.</span></p><p style="margin-left:28px"><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">[10] Wang D, Ge P, Bi W, et al. Grain trajectory and grain workpiece contact analyses for modeling of grinding force and energy partition[J]. International Journal of Advanced Manufacturing Technology, 2014, 70(9-12):2111-2123.</span></p><p style="margin-left:28px"><span style="font-size:16px;font-family:&#39;Times New Roman&#39;,serif">[11] Wang D, Ge P, Zhang L, et al. Statistical Calculations of Grinding Abrasive Number Based on Normal Distribution[C]. Applied Mechanics &amp; Materials, 2012, 229-231:474-477.</span></p><p><br/></p>
教学<p style="margin-left:28px"><span style="font-size:16px;font-family:宋体">《机械设计》、《机械设计基础》</span></p>